Abstract
Fatigue tests were performed using single lap-joint specimens to obtain near-threshold fatigue crack growth data of solder joint under mode-II load. Attention was focused on the effect of high temperature aging and microstructures separately from the intermetallics. As a result, it was shown that the long cast time yielded the intermetallics and microstructures of the solder invariable regardless of aging condition. The granular micro-structure of the air-cooled specimens was shown to be inferior to the laminated micro-structure of the furnace-cooled specimens. Also, transition of fatigue crack behavior with ΔJ and the procedure of fatigue crack propagation from the pre-crack tip were discussed.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
