Abstract
To investigate and quantify the radiation emission of an electronic package model, the partial element equivalent circuit method combined with the field equivalence principle is developed in this paper and used for the near-field radiation prediction. Furthermore, this paper presents a novel electromagnetic bandgap (EBG) design to suppress the electromagnetic radiation. The simulation results obtained by the proposed method have been validated against the measurement; moreover, the simulation and measurement results demonstrate the noise suppression ability of the new designed EBG structure, which can be used to reduce the electromagnetic radiation of the package.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
More From: IEEE Transactions on Components, Packaging and Manufacturing Technology
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.