Abstract
Granular Ti1−xNbxN thin films, 0 ≤ x ≤ 0.77, were deposited on borosilicate glass substrates by RF magnetron sputtering. Conductive-atomic force microscopy (C-AFM) was employed to study the local electrical transport properties of Ti1−xNbxN thin films. Topography images reveal that the grain size in the films increased from 30 to 90 nm, as x increased from 0 to 0.77. For a constant applied voltage of 1 V, the local leakage current in Ti1−xNbxN films increased with an increase in x value. The measured current is in the order of nA and its flow is filamentary in nature. Current–voltage characteristics measured at different locations on each current image revealed that the local resistance drastically decreased with an increase in Nb concentration. Electron-grain boundary scattering and the presence of native oxide states are responsible for the increase in the local electrical resistance of the films.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
