Natural Fiber Incorporated Polymer Matrix Composites for Electronic Circuit Board Applications

V S Chandrika,Ishwarya Komalnu Raghavan,J Femila Roseline,C Jeeva,S Sanal Kumar,A Anamika,Bhagavathi Perumal,P Ganeshan

doi:10.1155/2022/3035169

Abstract

There are many more applications for fibre-reinforced epoxy composites than there are for metals and alloys today. For example, sustainable, recyclable, and biodegradable reinforcements have been used in numerous studies to improve the mechanical and thermal properties of composite materials. It was discovered that the properties of epoxy-based composites could be improved by combining biosolid waste sugarcane bagasse ash fillers, madar fibre, and epoxy resin. Conventional compression molding techniques were used to prepare the sugarcane bagasse ash (SBA) particles and madar fibre-reinforced epoxy resin-based composites (PMCs), which were loaded with varying amounts of fibre and fillers. Hybrid biocomposites were evaluated for mechanical (tensile, flexural, impact, and hardness) and water absorption characteristics. Epoxy matrix composites containing 28 wt.% madar fibre and 7 wt.% sugarcane bagasse ash fillers had tensile, flexural, hardness, and impact values of 61 MPa, 147 MPa, and 54 kJ/m2, respectively.

Highlights

In recent years, researchers all over the world have been studying to incorporate the inorganic nanoparticles or fillers into the polymer matrix. is work has attracted the increasing interest of the researchers because of the improved mechanical, thermal stability, electrical, optical, and wear resistance properties of several filler-based composites when compared with various neat polymers [1,2,3]
particles and madar fibre-reinforced epoxy resin-based composites (PMCs) are exploited in aircraft, automotive, and electronic applications. e fabrication of printed circuit boards (PCBs) mainly based on woven glass fibre cloths and other reinforcements, including paper, glass fibre matte, nonwoven glass fibres, nonwoven aramid fibres, and other fillers, is the most widely utilized for PCB materials
E ultimate tensile strengths of 0, 1, 3, 5, 7, and 9 wt. % of sugarcane bagasse ash-filled composites were in the range of 34, 39, 45, 52, 61, and 41 MPa, respectively

Summary

Introduction

Researchers all over the world have been studying to incorporate the inorganic nanoparticles or fillers into the polymer matrix. is work has attracted the increasing interest of the researchers because of the improved mechanical, thermal stability, electrical, optical, and wear resistance properties of several filler-based composites when compared with various neat polymers [1,2,3]. Is work has attracted the increasing interest of the researchers because of the improved mechanical, thermal stability, electrical, optical, and wear resistance properties of several filler-based composites when compared with various neat polymers [1,2,3]. E fabrication of printed circuit boards (PCBs) mainly based on woven glass fibre cloths and other reinforcements, including paper, glass fibre matte, nonwoven glass fibres, nonwoven aramid fibres, and other fillers, is the most widely utilized for PCB materials. Ey all contain resin systems, reinforcements, and conductors. A variety of technical applications have proven that natural fillers and fiber-reinforced thermoplastic composites

Methods

Results

Conclusion