Abstract
The development of new Pb-free Sn-based solder alloys in the packaging industry increasingly focuses on corrosion resistance enhancing. In this work, the positive effect by surface native oxide film in postponing the solder substrate degradation has been identified, and besides the corrosion resistance of native oxide film varies greatly on different compositional phases in the substrate. It is suggested that obtaining a corrosion-resistant native oxide film is one promising method in improving the corrosion resistance of solder alloys, and thus small additions of elements, prone to form a passivated native oxide film, are preferentially of interest.
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