Abstract

This study aimed to evaluate the dynamic mechanical properties and the creep behavior of glass/epoxy composites containing different void contents. A 3D reconstruction using X-ray microtomography (MCT) was done to determine void content, position, and morphology. Moreover, dynamic mechanical analysis over a wide temperature range and creep tests using different temperatures (from 30 °C to 210 °C) and stress levels (1, 5, and 10 MPa) were conducted. It was found that the void content interfered with the stress transferring, noted by a decrease in the storage modulus in the glassy region and by a higher creep deformation. Moreover, as the composites pass through the glass transition region, a more abrupt decay is observed due to higher dissipation energy in a shorter time. The trend of creep behavior by temperature and stress level is equally affected by the void content and morphology.

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