Nanotwin stability in alloyed copper under ambient and cryo-temperature dependent deformation states

Abstract

Nanometer size grains, solid solution strengthening, low temperatures, and a high density of nanotwins can provide significant strengthening to a material. Nevertheless, under loading the microstructure may evolve altering the effect of grain size, twin density, etc. on this strengthening. In some cases, these effects can be coupled as in detwinning, which is a mechanism for cryogenic grain growth. In this work, a series of copper nanotwinned columnar grains are solid solution alloyed with aluminum and subject to ambient and cryogenic (−196 °C) environments during mechanical indentation, with the influence of alloying on the detwinning evolution studied. Under indentation, at a lower aluminum solute content (2 at.%), the columnar grains bent corresponding to a loss of twins. At a higher aluminum solute content (8 at.%), the grains shear and retain the nanotwins. Atomistic-scale simulations reveal an increase in the incoherent twin boundary velocity with decreasing temperature, but this boundary velocity is reduced with increasing alloy solute content. The coupling of solid solution strengthening and nanotwin stabilization is then used to explain the microstructural stability as a function of indentation at different temperature conditions.