Abstract
The need for improving performance of electronic devices and electrical equipment has always resulted in new high-performance electrical insulating materials. One important issue is the necessity to use dielectric polymers with higher thermal conductivities. In this study, by forming ordered nanostructure in epoxy resin via introducing 4, 4’- dihydroxydiphenyl (DHDP), electrical insulating epoxy thermosets simultaneously having high thermal conductivity, high thermal stability, high glass transition temperatures and excellent dielectric properties were successfully prepared. The introduction of DHDP not only increases the rigidity of the modified epoxy chains but also results in ordered nanostructure in the modified epoxy thermosets, which is considered as the main factor for the performance improvement of the modified epoxy thermosets.
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