Nanosilver particles-based conductive patterns developed by direct soft imprint lithography

Abstract

For the direct patterning of electronic device structures, the present work explored an idea of using UV imprint based on nanosilver particles-dispersed UV (ultraviolet) curable resin. In current work, as-received Ag solution was applied to HEMA (hydroxyethyl methacrylate) as an ultraviolet (UV) curable precursor with the addition of photoinitiator (∼3 wt%) to formulate electrically conductive resin mixtures with the Ag contents of 40–60 wt%. The UV exposed imprinted patterns with PDMS (polydimethylsiloxane) stamp become electrically conductive after properly optimized heat treatment. Those are, then, wet-etched to remove imprint residue, which lead to the formation of the isolated current transfer media. This imprint scheme can contribute to substantially reduced process steps and corresponding costs associated with additional metal processes.