Nanosecond laser grooving of water-immersed silicon carbide assisted by high intensity focused ultrasound (HIFU)

Abstract

Silicon carbide (SiC) is a very important semiconductor and ceramic material with many applications. However, its micromachining is difficult and it is still challenging to achieve a good combination of high quality, productivity and low cost. The corresponding author previously proposed the “ultrasound-assisted water-confined laser micromachining” (UWLM) process, a new machining technology utilizing in-situ ultrasound to improve laser machining of a water-covered workpiece. The author's previous studies show that UWLM based upon a high intensity focused ultrasound (HIFU) transducer is able to produce a relatively high machining rate and quality for metals. Thus, it is natural to guess the HIFU-based UWLM process might also possibly help provide a good solution for SiC micromachining. However, SiC have properties very different from metals. An experimental study is critically needed to confirm whether or not HIFU-based UWLM can still produce a high machining rate and quality for SiC, and overcome additional challenge(s) arising (if any). However, such a study is seldom reported to the authors' knowledge. This paper reports a study on the micro grooving of SiC via the HIFU-based UWLM process. With the conditions in this study, it has been found that UWLM can produce a much better apparent groove quality (i.e., much less recast material and/or debris re-deposition) than the laser machining process in the ambient air, and a much higher machining depth per pulse than the laser machining process in water with no ultrasound. The likely fundamental mechanism is the in-situ cleaning effect due to ultrasound-induced cavitation flow and pressure waves in water. The laser machining process in water with or without ultrasound can produce cracks at relatively low pulse repetition rates (PRRs). Time-resolved pressure measurements in water have been performed to help analyze stress sources causing the cracks. The crack problem appears to be effectively solved by using a relatively high PRR of 5 kHz. One possible major reason is expected to be the inter-pulse thermal accumulation effect at the high PRR, improving workpiece fracture toughness and/or reducing temperature gradients.