Abstract
The controllable wire bonding of individual Ag nanowires onto a Au electrode was achieved at room temperature. The plastic deformation induced by pressure using nanoindentation could break the protective organic shell on the surface of the Ag nanowires and cause atomic contact to promote the diffusion and nanojoining at the Ag and Au interface. Severe slip bands were observed in the Ag nanowires after the deformation. A metallic bond was formed at the interface, with the Ag diffusing into the Au more than the Au diffused into the Ag. This nanoscale wire bonding might present opportunities for nanoscale packaging and nanodevice design.Graphical
Highlights
Gold (Au) wire has been used for decades in wire bonding, a technique to interconnect an integrated circuit chip with metal leads in the semiconductor industry [1]
The plastic deformation induced by pressure using nanoindentation could break the protective organic shell on the surface of the Ag nanowires and cause atomic contact to promote the diffusion and nanojoining at the Ag and Au interface
Ag NWs could be controllably bonded onto a Au substrate by applying pressure with the assistance of nanoindentation at room temperature
Summary
Gold (Au) wire has been used for decades in wire bonding, a technique to interconnect an integrated circuit chip with metal leads in the semiconductor industry [1]. The cost of Au wire has significantly increased in recent years [2]. This has prompted the study and use of alternatives such as silver (Ag) [3, 4], copper (Cu) [5,6,7], and Ag/Au alloys [8, 9]. Cu wire suffers from oxidation issues, as well as a high hardness and Young’s modulus. Various intermetallic compounds have been prepared that would
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