Abstract
The evolution and strengthening effect of nanoscale precipitates of the aged Cu-Mg-Fe-Sn-P-Y alloy were investigated via aging treatment in the 400–480°C temperature range and the 10–480min aging time range. Nanoscale γ-Fe particles uniformly distributed in the matrix caused dispersion strengthening in the peak-aging stage and transformed to α-Fe at the over-aging stage. The Mg3P2 secondary phase hindered the appearance of coarse Fe3P and formed definite orientation relationship (OR) of cubic to cubic with the Cu matrix after 480min aging, <110>Cu||<110>Mg3P2, (002)Cu||(008)Mg3P2. The optimal aging parameter for the Cu-Mg-Fe-Sn-P-Y alloy is 60% cold deformation and aged at 460°C for 20min. The corresponding tensile strength is 599MPa with the conductivity of 71.1%IACS and the elongation of 6.9%. Compared with the current contact wire, the ultimate tensile strength and conductivity of the studied alloy increased by 20% and 15%, respectively.
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