Nanoscale Plasticity at Grain Boundaries in Face-centered Cubic Copper Under Shock Loading

Abstract

We investigate the responses of four representative grain boundaries in face-centered cubic Cu bicrystals to shock compression as a function of the loading direction. Two loading directions are considered, either parallel or perpendicular to the grain boundary plane, representing the extremes that a polycrystalline sample will ordinarily experience under the uniaxial strain conditions of planar shock loading. Using molecular dynamics simulations, we demonstrate that the deformation processes during shock compression of the same boundary are altered measurably by changing the loading direction. The Majority of the differences in the nanoscale deformation processes were related to the activation of varying slip systems in the same boundary under the two loading conditions. This change in deformation processes, and hence the plastic response, might eventually affect the failure stress for a grain boundary.