Nano-Scale MOSFET Devices Fabricated Using a Novel Carbon-Nanotube-based Lithography

Abstract

AbstractPECVD-grown carbon nanotubes on (100) silicon substrates have been studied and exploited for electron emission applications. The growth of CNT's is achieved by a mixture of hydrogen and acetylene gases in a CVD reactor and a 2-5nm thick nickel is used as the seed for the growth. The presence of DC-plasma yields a vertical growth and allows deposition at temperatures below 650°C. The grown nano-tubes are encapsulated by means of an insulating TiO2 layer, leading to beam-shape emission of electrons from the cathode towards the opposite anode electrode. The electron emission occurs using an anode-cathode voltage of 100 V with ability of direct writing on a photo-resist coated substrates. Straight lines with widths between 50 and 200nm have been successfully drawn. Scanning electron and transmission electron microscopy have been used to investigate the quality and fineness of the results. This technique has been applied on P-type (100) silicon substrates for the formation of the gate region of N-MOSFET devices, showing a drive current of 310μA/μm and Cox of 0.7μF/cm2.