Abstract

Bulk Metallic Glass (BMG) has been molded against silicon dies to fabricate both microstructures and nanostructures. At the microscale, geometrically complex, high aspect ratio microfeatures have been developed into controlled geometries [1–4]. A demand exists to control the nanofeatures in a similar manner. In past research, a thin film model was presented to predict the pressure distribution across the BMG during the molding process when it is in the supercooled liquid state [5]. In this paper, a flow model is presented to predict the achievable nanoscale feature sizes and aspect ratios. This model contains a viscous term to account for the required force to produce flow, and a capillary pressure term to account for the required energy to overcome surface effects. Silicon molds are being produced with various trench sizes over a relatively large area in order to validate these models.

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