Abstract
In this study, nanoscale corrosion behavior of copper fine wires in dilute NaCl solution is studied by atomic force microscopy and electron backscatter diffraction. The dissolution rate of grains constituting the wires strongly depends on their crystallographic orientation. In pure water, the dissolution rate increases in the order of (111)<(001)<(110). Addition of Cl− dramatically increases the dissolution rate of the (111) surface to alter the order to (110)≈(001)≈(111) at 0.1mM. These results show that the crystallographic orientation dependence is significantly changed by a slight increase of Cl− concentration in dilute solution.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
