Abstract
Nanomechanical properties of indium nanowires like structures fabricated on quartz substrate by trench template technique, measured using nanoindentation. The hardness and elastic modulus of wires were measured and compared with the values of indium thin film. Displacement burst observed while indenting the nanowire. ‘Wire-only hardness’ obtained using Korsunsky model from composite hardness. Nanowires have exhibited almost same modulus as indium thin film but considerable changes were observed in hardness value.
Highlights
Nanomechanical properties of indium nanowires like structures fabricated on quartz substrate by trench template technique, measured using nanoindentation
Nanowires have exhibited almost same modulus as indium thin film but considerable changes were observed in hardness value
Indium nanowires have been successfully synthesized by various techniques such as porous alumina template by hydraulic pressure injection technique [14, 15] for luminescence applications, potentiostatic stationary electrodeposition from an InCl3-based solution [16], single crystal indium nanowires using ultrafast rate by focused ion beam (FIB) [3], their mechanical properties have not been discussed much
Summary
Low-dimension structures such as nanowires/dots/rods have attracted considerable interest to the scientific community in the past decade both for their size-dependent physical and chemical properties [1] and their potential in the research and development of new optoelectronic and microelectronic devices. For the first time to our knowledge, the hardness and elastic modulus of indium nanowires (different diameters) fabricated by trench template method using nanoindentation technique. Indium nano/microwires were fabricated inside the V-trench (2–20 lm diameter, 100–200 nm depth) templates scribed by electronically controlled diamond scriber with the provision of load selection on thoroughly cleaned quartz substrate by vapour condensation (thermal evaporation) at high vacuum (1 9 10-6 mbar). The indenter has penetrated up to the substrate surface at higher loads, but there was no sign of radial crack formation of the film/wire It means that indium wires are in good adhesion towards the substrate. Indentation-projected area calibration eliminates the wire curvature effects on the mechanical properties Both the methods have resulted different values of hardness.
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