Abstract
This work investigates the influence of an Ag nanoparticle addition on the microstructure, microhardness, creep, temperature-dependent elastic properties, damping capacity, and shear strength of an environmentally friendly eutectic Sn-9Zn (wt.%) material. A microstructure analysis confirmed that adding Ag nanoparticles significantly altered the morphologies of the Zn-rich phase, which includes the size and shape in the presence of fine spherical-shaped AgZn3 intermetallic compound (IMC) particles in the β-Sn matrix. These fine microstructures positively impact on microhardness, creep, damping capacity, and temperature-dependent elastic properties. Furthermore, in the electronic interconnection on an Au/Ni-plated-Cu pad ball grid array (BGA) substrate, adding Ag nanoparticles generates an additional AgZn3 IMC layer at the top surface of the AuZn3 IMC layer. It also significantly improves the oxidation resistance of Sn-Zn material due to the formation of fine AgZn3 IMC particles. Moreover, the interfacial shear strength value of the Sn-Zn material doped with Ag nanoparticles on the Au/Ni-Cu pad BGA substrate increased about 12% as compared to the reference material after five minutes of reaction in the presence of a fine Zn-rich phase and AgZn3 IMC particles, which acted as second phase dispersion strengthening mechanism. Adding Ag nanoparticles also altered the fracture mode to a typical ductile failure with rough dimpled surfaces of the Sn-Zn material.
Highlights
In modern electronic packaging systems, electronic interconnection plays an important role in providing mechanical and electrical support to chips and integrated circuits (ICs) on printed circuit boards (PCBs), which directly influences the reliability and performance of electronic devices [1,2].Until the early eighties, eutectic or near eutectic Sn-Pb-based materials were widely used in microelectronic systems [3,4,5,6]
The present study investigates the influence of an Ag nanoparticle addition on the microstructure and material properties of an environmentally friendly Sn-9Zn-based material for green electronic devices
Interesting phenomena were observed after adding Ag nanoparticles, and it was found that the aspect ratio of the Zn-rich phase was changed significantly and appeared to have a fine structure
Summary
Eutectic or near eutectic Sn-Pb-based materials were widely used in microelectronic systems [3,4,5,6]. Their inherent toxicity to human health and the environmental restriction of their applications [7,8,9,10] caused them to be replaced with an environmentally friendly material with a similar melting temperature and mechanical properties. Metals 2020, 10, 1137 material, with a low melting temperature that is close to that of the traditional Sn-37Pb alloy (183 ◦ C), have caused it to be considered one of the best choices for applications in green electronic products.
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