Abstract
The nanofluidic chips with channels of 100-nm depth and 3-μm width were employed as molecular flow standard leak elements for vacuum technology applications in this paper. The nanofluidic chips are fabricated by MEMS technologies while the macro-micro connection is achieved using glass fusion bonding and standard Swagelok® Fitting. It is found that the choice of annealing temperature and holding time is a key issue regarding fusion bonding and the optimal processing parameters are 780 ℃, 5 min. Meanwhile, the sealing reliability of fusion bonding and the fitting connection is evaluated. Experiment shows that the flow conductance of the as-fabricated leak can reach 10−13 m3∙s−1 magnitude for He, N2 and Ar. This standard leak has the advantages of controlled dimensions, reliable connection, and constant flow conductance over a range of 105 Pa.
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