Abstract
A new nano-diamond based mechanical polishing process has been developed and optimized for polishing super hard materials such as SiC, sapphire and diamond samples. The nano-diamond based process uses specially engineered nano-diamond particles that has ability to react with super hard materials when used for polishing. Such a reactive nano-diamond process leads to removal rates of about an order higher than the base particles and yields ultra-smooth surfaces (RMS <0.5nm) on the super hard materials along with very low sub-surface damage. The process yielded surface roughness less than 1 nm for silicon carbide, sapphire and diamond materials. The process has been studied for single crystalline, poly-crystalline and composite materials. The removal rates for different materials with the newly developed nano-diamond process compared to base nano-diamond particles and the surface finish obtained with the use of atomic force microscope, optical interferometer and tropel flat master will be presented. The mechanism of nano-diamond process will be explained in the conference.
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