Abstract
In this work, the nano boron nitride (BN) was modified by poly(dopamine) and micro aluminium nitride (AlN) was modified by y-(2,3-epoxypropoxy)propytrimethoxysilane. Then the nano-BN was anchored though the chemical bonding reaction onto the surface of micro-AlN. The epoxy composites with the BN encapsulated AlN hybrid filler were prepared, showing a enhanced thermal conductivity of 1.449 W/(m-k), which is 946% higher than that of EP, 0.153 W/(m-k). And the results of dielectric breakdown experiments in high voltage at high frequency show that the sufficient dielectric strength with breakdown time of 72.6s, which is 256% higher than that of EP, 28.33s. This work provides a facile method for preparing high-performance epoxy composites with high thermal conductivity and sufficient dielectric breakdown strength.
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