Nano-silver modified carbon nanotubes to reinforce the copper matrix composites and their mechanical properties

Abstract

• The powder electrodeposition technology is employed to synthesize coating material. • CNT-Ag is uniformly distributed in copper matrix. • Ag improves the wettability of carbon nanotubes with copper matrix. • Ag particles played a “pinning” role of the CNTs and improve the load transfer capacity. In ensuring the effective load transfer of carbon nanotubes (CNTs) reinforced copper (Cu)-based composites, good and stable interface contact is a key factor. Powder electrodeposition technology is used in the present study to coat silver (Ag) nanoparticles on CNTs for the first time. Subsequently, by ball milling and spark plasma sintering, uniform distribution of CNTs in the Cu matrix and tight Cu/C interface bonding are successfully achieved. It is found that Ag nanoparticles with a size of 5 nm are evenly embedded in the surface of CNTs. The results reveal that the agglomeration of CNTs is prevented by the addition of Ag nanoparticles and the adhesion between CNTs and Cu matrix is enhanced by the formation of coherent interface. Further, the load transfer of composite materials is effectively realized by the pinning effect of Ag particles on CNTs. The tensile strength, elongation, and conductivity of the 0.75 CNT-Ag/Cu samples were 314 MPa, 24.8%, and 93.6% IACS, respectively, which are 40.1%, 818%, and 3.3% higher than those of the CNT/Cu samples, respectively. The present method provides a new direction for the uniform coating powder materials and the synergistic strengthening of metal matrix composites.