Abstract

Particle’s behavior in the slurry with power-law viscosity shows great effect on the wafer surface polishing process. Hydrodynamic pressure is periodically generated on the surface asperity when particles are passing through. Due to the periodical pressure, fatigue fracture occurs and begins from the top to the bottom of the asperity, then the material on the top is removed. Removal rate is calculated based on the energybalance fracture theory, and the result shows good agreement with experiment data. The effects of the particle size and the slurry film thickness are also discussed.

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