Abstract

For low temperature interconnects, melting point (T/sub m/) depression and sintering behavior of metal nano particles are investigated. Nano Ag particles used (/spl sim/20 nm) exhibited obvious sintering behavior, rather than typical melting behavior, at significantly lower temperatures (/spl sim/150 /spl deg/C) than its T/sub m/ (1235/spl deg/C) . The particle surface was characterized by XPS, FTIR and TGA. The thermal behavior was studied by DSC and TGA. The crystal structure of the particle was examined by XRD. The shrinkage of the nano particles during sintering was monitored by TMA. Sintering behavior of the nano particles is discussed.

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