Abstract
Numerical analysis of the electric current distribution during tin plating in plating cell measuring 15mm in width and ca. 1, 000mm in length, in which the plating solution was supplied through the solution inlet on the center of an unconsumable anode, was carried out, and compared with experimental results. It was found that;(1) Current density in the cell can be found using the Laplace equation.(2) The shape of the solution inlet had a great influence on the uniformity of tin coating thickness. Using inlets of identical area, making inlet width less than cell width, so that part of the electrode remains between the inlet and the cell walls on either side, was advantageous in maintaining uniform coating thickness distribution. The vertical (internal) electrode on the side wall of the inlet also contributed to the same aim.(3) The electrode current density near the inlet was about twice that of the usual sites, compensating for the adverse effect due to the absence of an electrode.
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