Abstract
The Effect of inclusion on room temperature softening of copper film electrodeposited from ethylenediamine complex baths was investigated along with its mechanism.Copper film electrodeposited from ethylenediamine complex baths under optimal plating conditions was found to increase in crystallite size and decrease in microhardness with the preservation of room temperature. This phenomenon was only found in cases of small crystallite size, containing a small quantity of inclusion at the time of electrodepositing.
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