Abstract

It has been shown in our experiments that the grinding performance of the Resinoid Bonded CBN grinding wheel depends on TSUKIDASHIRYO. TSUKIDASHIRYO herein is referred as the distance of the grinding edge of the grains to the bond on the grinding wheel surface. It was found that the grinding performance reaches its maximum when this TSUKIDASHIRYO is about 30 μm. The grinding ratio was more than 250 times as much as that of an ordinary grinding wheel, while the wheel life (the time the surface roughness exceeds 3 μmRz) was over 40 times longer. It was also found that as long as the grain depth is correct, any material can be ground effectively whether it is untreated or hardened material of SCM 435, or chilled iron. The wheel was first dressed in order to create the desired TSUKIDASHIRYO in the experiments, and it was found that the wheel surface was subjected to "damage" by dressing. However, this "damage" effect lessened as grinding and truing (carried out when the surface roughness deteriorated) were successively repeated, and the grinding ratio and the grinding amount between truing operations increased.

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