Abstract
When palladium-plated lead frames are used for ICs, solder bridging and silver migration do not occur.In this report, palladium plated lead frames were studied for such characteristics as solderability and wire-bondability after thermal treatment to simulate IC assembly. Their corrosion resistance was also studied.The following results were obtained.(1) Solderability of 0.05μm-thick palladium plating was virtually as good as that of 5μm-thick Sn 90wt% solder plating.(2) Palladium-plated lead frames had excellent solderability and gold wire-bondability even after heating at 300°C for about 1min.(3) The corrosion resistance of the palladium plating on copper alloy substrates was relatively good, but on ferro-alloy substrates, considerable pitting corrosion occured due to the difference in natural electrode potential between the palladium and the substrate.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a call
