記録ヘッドの狭トラック化プロセス技術

Abstract

This paper describes two methods of making narrow photoresist frame patterns to fabricate the top pole of writing elements. First, a KrF excimer laser stepper was used to expose a thick photoresist for fabrication of top poles. Second, the tri-layer resist frame method using reactive ion etching (RIE) was examined for fabricating the resist frame. Thick photoresist could be resolved by the KrF excimer laser stepper. Furthermore, the off-axis (annular) illumination exposure method could increase the depth of focus. By using Ta hard mask layer for the tri-layer resist frame method, we were able to make a 0.25-μm wide frame.