Abstract
Mounting technologies with high reliability were investigated for flip chip bonding of LSI chips on glass substrate in chip on type liquid crystal displays.For metallic film conductor on glass substrate, four layered structure of Cr-Ni-Cu-Cr was found to be the best combination. Best selective etching solution for each metal was found and metal thicknesses were optimized.For protection material of metallic film, sputtered SiO2 film was chosen because of good reliability in operating life test. In order to obtain highly reliable LSI chips under thermal shock test condition, the thermal expansion coefficient of covering epoxy resin was taken to be nearlly equal to that of 95Pb-5Sn solder by controlling amount of added Si powder.
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