Abstract
When electronic components are used over a long period of time, internal cracking and delamination can cause failures. It is important to predict and evaluate the mechanical behavior in the vicinity of cracks, which are the starting point of such failures. It is known that when an electric current flows through a cracked metal, the thermal stress caused by the Joule heat becomes a singular field around the crack. The temperature distribution near the crack can be related to the stress intensity factor by the path integral representing the electric potential distribution (1). In this paper, we investigate the fracture mechanics parameters of cracked copper lines under mechanical and electrical stress. When using the finite element method for research, it is necessary to investigate the difference between the stress intensity factor calculated by the path integral and the stress intensity factor obtained by other methods. Therefore, a finite element analysis of a crack model is performed to investigate the stress intensity factor and J-integral values under independent mechanical and electrical conditions.
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