手机背板用氧化锆陶瓷流延片烧结工艺研究

Abstract

本文比较分析了作为手机背板的氧化锆流延基片烧结过程中的变形与自由平放、压重、腾空三种装炉方式之间的关系，探究了用于平复氧化锆手机背板翘曲的整平处理工艺。结果表明压重装炉方式和腾空装炉方式可用于限制在作为手机背板的氧化锆流延基片烧结过程中的变形，其中压重装炉方式不适合大面积薄片流延基片的烧结；采用腾空装炉方式烧结的氧化锆流延基片，经过在1400℃保温4小时的整平处理，可以得到较为平整的手机背板。 This paper compares and analyzes the relationship between the deformation of the zirconia tape casting uropatagia used as the mobile phone backboard during the sintering process and three placing modes including free placement, ballasting placement and placing baffle a certain height fromuropatagia, and it also researches the smoothing process used for smooth the warping zirconia backboard of the mobile phone. The result showed that ballasting placement and placing baffle a certain height from uropatagia can be used to restrain the deformation of the zirconia tape casting uropatagia used as the mobile phone backboard during the sintering process. Among it, ballasting placement was not suitable for the sintering of large-area tape casting uropatagia; and the zirconia tape casting uropatagia sintered by means of placing baffle a certain height from uropatagia could be made into relatively smooth mobile phone backboard after the smoothing process, maintaining sintering temperature at 1400˚C for four hours.