Abstract
We have developed Self-releasing adhesive tapes “SELFA” for manufacturing of ultra thin semi-conductor wafers. With the new tape, the semi-conductor wafer is fixed and supported properly on the glass board. After ultra thin process, adhesive starts self-releasing with UV irradiation. And then for the process of dicing, we have developed self-releasing dicing tape for ultra-thin wafer and its application to UV-needleless pickup system.This report states the mechanism of self-releasing and the characteristics of the new tapes and the application to an ultra thin manufacturing system for wafers.
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