Abstract
Polishing is generally used in fabricating high-quality silicon wafers. Polishing efficiency and accuracy depend not only on the pad surface texture but also the actual conditions of contact between the wafer and the pad. Furthermore, the pad surface texture is affected by the dressing conditions. Currently, no effective quantitative methods or parameters for pad surface evaluation have been established. In this study, we propose a technique based on contact image analysis using an image rotation prism. We also discuss the effect of dressing conditions on the following parameters : (1) contact ratio, (2) number of contact points, (3) spacing of contact points and (4) spatial FFT results of a contact image. These parameters were found to be effective for evaluating pad surface texture.
Sign-in/Register to access full text options 
Free) 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a call
