Abstract
We propose a highly reliable thin film temperature sensor of 3x8x0.1mm, for which Nickel foil with a thickness of approx. 0.003mm is bonded onto a Zirconia baseboard of 0.05mm thickness using epoxy resin. The baseboard is then affixed to a ceramic reinforcing board of 0.40mm thickness with polyimide tape, and the fine resistance patterns in the nickel foil are fabricated using photo-etching technology. The resulting resistance patterns are then covered with another Zirconia baseboard using epoxy resin to protect from damage, moisture and acid in the air. Some of the key performance characteristics are a response time of about 6s in air and an accuracy drift of only ±0.01°C/year. As a result this temperature sensor will be applied to the precision manufacturing, semiconductor, and other industries where high accuracy and high reliability are demanded.
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