Abstract
The present paper introduces an electrostatic microactuator called the conical spring linear actuator (CSLA) which is capable of stepwise motion vertical to the substrate. The CSLA has a moving electrode, in the form of a three-dimensional conical spring, which is placed on four base electrodes. In order to realize the conical spring shape, the moving electrode is constructed of thin film metallic glass (TFMG), which is a new MEMS material. TFMG is a kind of amorphous alloy which softens at a range of temperatures referred to as the supercooled liquid region (SCLR). In the SCLR TFMG can easily be deformed into 3D structures. The present paper introduces a new fabrication process which can be applied to the integration of the CSLA and discusses experimental driving of integrated CSLA. The integrated CSLA shows 200 μm total stepwise displacement vertical to the substrate.
Sign-in/Register to access full text options 
Free) 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a call
