Abstract
We evaluated the semiconductor mounting substrate and investigated the whisker's generations and factors by experimenting different environmental conditions. On the lead consisted of Cu base/Sn plating, the result of the condition 110°C/85% & 120°C/85% which were produced by Air-HAST (HAST with air) generates Sn whiskers faster than other high temperature and humidity tests. We concluded that the factors in the whisker generation are high temperatures, high moisture and oxygen.
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More From: Journal of Japan Institute of Electronics Packaging
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