電子デバイスの導電性樹脂による実装プロセスの検討

Abstract

Electric devices with semiconductors are applied to all apparatus including substation equipment, transport machines, home electronics, and cellular phones. Power modules deal large current, and high frequency/optical modules control GHz band signals. As a result, these semiconductors have more than 100 times heat density of memory or MPU chips. Pb-rich high temperature solder and expensive Au-rich solder are applied to these modules, however, thermal stress might be a problem not only for long-term reliability but also for the initial characteristics. The authors studied the assembly of these electric devices using conductive adhesive as a substitute bonding material. We proved that atmospheric aluminum oxides caused electric resistance and that power chips with long rectangle sides over 10 mm have a much larger thermal resistance than theoretical values. We found that it is effective to scratch and remove these oxides through transferred adhesive on aluminum electrodes and to diebond them onto the solder projection previously formed on the die pads.