Abstract
A new sputtering target was proposed for high-rate deposition fabrication of double layer perpendicular media. The target consisted of Permalloy plate walls which were perpendicular to the substrate and worked themselves as a part of the magnetic circuit for plasma confining. Discharge characteristics of the target were very preferable for low-pressure and high-power sputtering at a low discharge voltage. Obtained Permalloy films showed a wider homogeneous thickness region and much stronger adhesion to a polyimide substrate compared with a conventional GT target.
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