Abstract
In this study, the tensile strength of a bicrystal sample cut from a polycrystalline copper thin film was investigated by applying a micro tensile test system. As the previous researches have showed that the crystallinity of a grain boundary was evaluated quantitatively by using IQ (Image Quality) value obtained from EBSD (Electron Back-Scatter Diffraction) analysis, and plastic deformations started to occur in one grain in the sample when the IQ value was higher than 3500. In this study, the plastic deformation of one grain was observed in detail after the sample was pulled off by using SEM (Scanning electron microscope). Slip bands were observed clearly on the fracture surface.
Published Version
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