Abstract
The grinding of ceramics with diamond wheels has disadvantages such as low stock removal rates or reduction of the strength of workpieces. This paper describes scratch tests with single point diamond tools and grinding experiments with diamond wheels in order to analyze the grinding mechanism of ceramics and overcome these disadvantages. The following results were obtained. (1) Specific grinding energy of ceramics is strongly correlated with fracture toughness and hardness. (2) Chips are removed as a result of the generation and growth of cracks, so called “fracture machining”. (3) Fracture machining is achieved at a high depth of cut, and improves both the stock removal rate and the grinding ratio. (4) The crack layer induced by fracture machining at a 40 μm depth of cut and 20m/min table speed can be removed by the finished grinding using a # 800 diamond wheel and the bending strength of SiC results in recovering up to that of the base material.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callMore From: Journal of the Japan Society for Precision Engineering
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
