Abstract
The effects of boric acid and plating bath pH on the average internal strain in electrically deposited nickel films were investigated by an electric resistance wire type strain gauge setup on the reverse side of a copper substrate having a preferred crystal orientation of (200), and the relation between the average internal strain and the preferred crystal orientation of the nickel film was also discussed.It was found that: (1) The internal strain in the nickel films rose rapidly with increasing bath pH near the electrode during hydrogen codeposition. (2) The addition of boric acid to the bath inhibited the hydrogen evolution reaction during nickel deposition, resulting in suppression of the rise in the internal strain in the nickel film. (3) The internal strain in nickel films deposited on the copper substrate rose in the order of (200)<(220)<(111)<disordered in terms of the preferred orientation relative to the ASTM standard for nickel powder. The brightness of the deposits also showed the same dependence on preferred orientation as did internal strain.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
