Abstract
In this report, the new encapsulation technology for electronic devices, such as IC, has been investigated using the injection moulding process to substitute for the transfer moulding method conventionally used so far. And the analysis has been carried out utilizing the computer simulation program covering cavity filling behavior to examine the quantitative relationship between the deformation and/or breaking-down of gold wires bonded with IC chips and processing factors, such as mould geometries, injection conditions and physical properties of resin encapsulants. As a result, the new technology to obtain good products preventing gold wire deformation within the practical level has been established concerning various kinds of cold-runner and hot-runner moulds. Furthermore, the new type of the injection moulding machine developed for the purpose of the resin encapsulation has been described in this report.
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