Abstract
This study investigated the effect of lead on whisker growth of a tin film that was electrodeposited onto a phosphor bronze substrate using FE-SEM, FE-AES, FE-EPMA, GD-OES, and XPS.Subsequent FE-AES observation revealed that the whisker growth on the electrodeposited tin film varied depending on the oxide film condition. The whisker growth was suppressed concomitantly with thinness or fragility of the oxide film formed on the tin deposits. The whisker growth was also suppressed concomitantly with lead co-deposition in the tin deposits. In the Sn/Sn-Pb double layer, because the lead between the tin film and the substrate was transferred to the surface, the whisker growth was also suppressed. This whisker growth suppression effect caused by the existence of lead in the tin deposits was attributed to oxide film thinning and embrittlement, depending on the lead transfer to the surface at room temperature.
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