Abstract
Investigation of the effects of continuous precision filtration on electroless copper plating has confirmed that the extraneous deposition phenomena occurring during long-term plating are caused by insoluble particles that accumulate in the plating bath. Simulation of 5 turnovers of an aging bath indicated the presence of more than two millions particles larger than 1μm diameter per liter of bath, and that they were mainly composed of Al, Si, Fe and Na.The properties of the copper film deposited were greatly influenced by this extraneous deposition, which decreased with batch type filtration, but tend to increase with the passage of plating time. Continuous precision filtration during plating, however, drastically suppressed extraneous deposition and increased the elongation of the deposited copper film about twofold.
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