Abstract
It is not easy to evaluate thin film/substrate adhesion and to characterize the thin film/substrate interface when adhesion is strong. For this purpose, a new method (scratch-ESCA test), which is a combination of the scratch test, the peeling (by adhesive tape) test, and the ESCA (electron spectroscopy for chemical analysis) measurement, has been developed and is applied to the study of CVD (Chemically vapor deposited) WSix (tungsten silicide)/poly (polycrystalline) Si adhesion. In addition to the conventional adhesion evaluation by the scratch test, it is possible to evaluate adhesion by measuring (with ESCA) the amount of WSix film peeled off from poly Si by an adhesive tape after the scratch test. At the same time, WSix/poly Si interface can be characterized from the results of this ESCA measurement.The results of the above adhesion evaluation are found to have a good correlation with the tendency of WSix films to delaminate or peel during semiconductor device manufacturing processes. The interface characterization by ESCA shows that the WSix adhesion is affected by the presence of such elements as F, O, C and N at this interface.It is believed that this scratch-ESCA test will be a powerful tool for the adhesion evaluation of well-adhering thin films, determination of various factors influencing adhesion, and characterization of interfaces in general.
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