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Abstract
A new technology for making multi-layered ceramic substrate have been developed withcopper foil patterning which has brought the best solution to low electrical resistivity wiringsystem. The multi-layers board consists of glass-ceramic substrate, copper inner via and copper foil pattern. This ceramic substrate has been fabricated by the zero X-Y shrinkage sintering process, which can achieve the co-firing system with copper foil and ceramic green sheets. This paper presents the results of our study, the condition of the ceramic green sheet for theforming copper foil wiring pattern and the characteristics of the ceramic substrate and copperwiring system.
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