Abstract
Room temperature softening of copper film electrodeposited from ethylenediamine complex baths was investigated along with its mechanism.The bright copper film electrodeposited from baths containing a small quantity of thiodiglycollic acid were of small crystallite size and contained small amounts of impurities. The films obtained were found to increase in crystallite size, decrease in microhardness and undergo orientation transformations into closed packed facet of the fcc lattice, resulting in a first recrystallization at room temperature.
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