Abstract
The mechanical and magnetic properties of thinfilm media using newly developed carbon substrates, which have advantages such as light weight, high heat resistance,and non-magnetism, were investigated in comparison with the properties of thinfilm media using conventional NiP/Al substrates. The adhesive strength of a thin-film medium sputtered on a carbon substrate is higher than that of one sputtered on a NiP/Al substrate, because of the formation of Cr-C compounds at the interface between the carbon substrate and the Cr underlayer. The coercivity of a thin-film medium sputtered on a carbon substrate is also higher than that of one sputtered on a NiP/Al substrate, because of the unique surface morphology. High coercivity can be obtained by using a circumferentially textured substrate and a bias sputtering method.
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