Abstract
An electro-graph test using zinc instead of cadmium was evaluated as a alternative porosity measurement method. This technique was effective in the porosity evaluation of electroless nickel plating on copper substrate.Pinholes of electroless nickel deposits produced on copper substrate by the conventional palladium catalyst process have been compared to direct electroless nickel plating on copper using DMAB as a second reducing agent.Results confirmed that fewer pinholes are produced on electroless nickel films when not using the palladium catalyst process than with films treated using the conventional palladium catalyst process. The direct electroless nickel plating films displayed excellent corrosion resistance.
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